| 主要规格及技术指标 |
"主要规格&技术指标
1.载荷加载方式：静电力驱动；
2.高精度加载器：最大载荷 ≥ 50mN；载荷分辨率≤3nN；最大压痕深度≥20μm；位移分辨率≤0.002nm；
3.XP加载装置：最大载荷≥500mN；载荷分辨率≤50nN；位移分辨率≤0.01nm；最大压痕深度≥500μm；
4.热漂移：≤0.05nm/s；
5.连续刚度测试功能（CSM）:获得接触刚度、硬度和弹性模量随压痕深度的连续函数分布；简谐力频率范围: 0.1Hz - 1000 Hz；简谐力振幅范围: 0.01μN–4.5mN；
6.XY两个方向的上传感器，可以任意方向测摩檫力；最大划擦深度≥500μm；最大划痕长度≥200 mm；最大划擦载荷≥500mN；最大横向力 ≥250mN；最大磨损深度 ≥500μm；最大磨损面积 ≥20mm*20mm；
7.不更换样品台，可以对多个样品进行连续不间断的3D原位扫描成像；原位扫描探针的位置定位精度：±20nm；
8超薄膜测试：AccuFilm 校正软基硬膜和硬基软膜对膜测量的基板影响，膜厚≥20nm；
9.动态力学测试频率范围：0.1Hz-1000Hz；简谐力振幅范围: 0.01μN–4.5mN；
10.I-V电学测试模块电流测试范围: 10aA～20mA；电压测试范围: 1uV～200V；电阻范围：1Ω～10E18Ω（Keithley 6517B）；
11.应力-应变模块：可利用10μm平头直接对块体材料进行应力应变测试；
12.3D Mapping功能：快速压痕1pt/s；一次性最多100000个压痕点（300×300阵列），并提供阵列中每个压痕点指定负载的E、H、S值；
13.常规样品台X方向移动范围≥200mm；Y 方向移动范围≥200mm；定位分辨率：≤ 0.1μm；定位精度：≤ 1μm；
14.高温模块激光加温，温度操作范围25℃到500℃；
15.显微镜放大倍率分别为 20X 和 40X 的物镜，屏幕上最高放大倍率≥1400X（含数字放大）；
16.数据采集频率100kHz；
1. Electromagnetic actuator to achieve the high dynamic range in force and displacement.
2. High-precision loading actuator: maximum load 50mN, load resolution 3nN, maximum indentation depth 20μm, displacement resolution 0.002nm.
3. XP loading actuator: maximum load 500mN, load resolution 50nN, displacement resolution 0.01nm, maximum indentation depth 500μm.
4. Thermal drift: lower than 0.05nm/s.
5. Modular options for testing beyond indenttation for SPM imaging, scratch testing, high temperature nanoindentation measurements, dynamic testing (CSM) and high-speed testing with 1pt/s test speed.
6. The applications: High speed hardness and modulus measurements (Oliver-Pharr); High speed material property maps; Yield Stress/Strain; ISO 14577 hardness testing; Thin films and coatings; Interfacial adhesion measurement; Fracture toughness measurement; Viscoelastic property measurements including tan delta, and storage and loss modulus; Scanning probe microscopy (3D imaging); Quantitative scratch and wear testing; High temperature nanoindentation testing, temperature range is 25 ℃ to 500 ℃; I-V testing.
7. High resolution optical microscope (20X and 40X) and precision XYZ motion system for viewing, positioning and targeting samples.
8. InQuest high-speed controller electronics with 100kHz data acquisition rate and 20µs time constant."
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| 主要功能及特色 |
"纳米压痕仪G200在微纳尺度上对材料通过压痕实现材料的硬度，弹性模量，接触刚度，蠕变应力指数，断裂韧性，贮存模量，损耗模量，阻尼等力学参数的测量，可以通过划痕实现材料的摩擦系数和临界载荷的测量。用于金属材料、聚合物材料、无机非金属材料、膜材料及复合材料等的纳米压/划痕等力学特性测试。
The Nano Indenter G200X provides an easy-to-use nanoscale mechanical tester that quickly delivers accurate, quantitative results through the indentation which can obtain the material hardness, modulus of elasticity, contact stiffness, creep stress index, fracture toughness, storage modulus, loss modulus, damping and other mechanical parameters of the material. The G200X nanoindenter system handles a wide variety of samples from hard coatings to soft polymers widely used in metal materials, polymer materials, inorganic non-metallic materials, membrane materials and composite materials. |
